Pure Copper Graphene Heatsink M.2 NGFF 22110 PCI-E NVME SSD Heat Sink Thermal Pad Conductivity Silicone Cooler Accessory

Specifications:

Brand ：iCEPC

Model Number: 22110 SSD Heatsink

Thermal Conductivity: 5300 W/m-k

Accessories Type: Heatsinks

Material: Copper Graphene.

Size: 100x23x10mm/2.76 x 0.91 x 0.35in

Weight: 81g

Quantity:1Pc

Product Description：

1. Graphene is the most efficient thermal conductor in the world. Its thermal conductivity can reach 5300W/m·K, pure copper is 401W/m·K, and aluminum is only 237 2W/m·K. Graphene coating and pure copper An efficient combination that can keep your device high performance all the time.

2.Applicable to M.2 Heatsinks : for 22110 size (22x110mm) M.2 NVME SSD, like SN750, 850 EVO, 860 EVO, 960 EVO, 970 EVO, 950 PRO, 960 PRO, 970PRO,PM981 etc.

3.Diversion type heat dissipation： High precision die is used to increase the heat dissipation area and improve the heat absorption capacity of the heat sink bottom. The concave convex heat sink and smooth air duct, that is, the heat between the heat sink and the heating equipment is small, which can quickly absorb the heat generated.

4. The hard disk contact surface adopts multiple polishing processes to reduce the gap between the radiator and the silicone thermal pad, and better improve the thermal conductivity.

5.Easy and conveneint to install and remove.

【Warm notice】Please remove the protective film from the silicone heat pad before use.

Package Includes:

1 x Heatsink

1 x Screwdriver

4 x Silicone Thermal Pads

5 x Screws