CX H1300 Thermal Putty 13.5W/m.K for VGA GPU IC Processor Rapid Cooling Thermal Pad Heat Blocking Putty Replacement 10/20/50/70g

Description

CX H1300 thermal putty is a high-performance mud-like heat conduction material. It is made of silica gel and filled with various high-performance ceramic powders.

CX H1300 thermal putty has high thermal conductivity, low thermal resistance, good compliance on heat dissipation parts, and Non-drying, insulating, can automatically fill the gap, increase the limited contact area, and can be compressed infinitely.

Specification:

Item: CX H1300 thermal putty

Conductivity: 13.5W/mk

Color: pink

Size: 10g/20g/50g/70g

Features and Benefits

1. Ultra-high thermal conductivity – 13.5W/mk (Compared with thermal pad, thermal putty has lower thermal resistance and better heat dissipation effect.)

2, Super high stability. (Compared with thermal grease, thermal putty will never dry, which can prolong the service life of electronic products and save costs.)

2. The thickness selection range can be from 0.08mm to 2.5mm,

3. Ultra-high insulation and No oil-bleeding (the breakdown voltage of thermal paste with a thickness of 1mm can reach 10KV)

4. High viscosity, close contact, infinite compression, can quickly reduce the temperature of electronic components.

Applications

Heat sink, Memory modules/LED Lighting, Laptop/Power Supplies

Control services/Military Electronics/Wireless instruments

Communications industry/Automotive Electronics